[1]CHEN Shu-yue,GU Wei,DAI Quan-yu.Influence of Inorganic Adhesive on the Physical Properties and Stability of Engineering Spoil[J].Research of Soil and Water Conservation,2013,20(05):86-91.
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Research of Soil and Water Conservation[ISSN 1005-3409/CN 61-1272/P] Volume:
20
Number of periods:
2013 05
Page number:
86-91
Column:
Public date:
2013-10-28
- Title:
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Influence of Inorganic Adhesive on the Physical Properties and Stability of Engineering Spoil
- Author(s):
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CHEN Shu-yue1, GU Wei1, DAI Quan-yu2
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1. State Key Laboratory of Earth Processes and Resource Ecology, Beijing Normal University, Beijing 100875, China;
2. China Rural Technology Development Center, Beijing 100045, China
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- Keywords:
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natural resource; plant growth substrate; artificial simulation of rainfall; inorganic adhesive; engineering spoil
- CLC:
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S152.3
- DOI:
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- Abstract:
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The engineering spoil and natural soil were mixed into a plant growth substrate. In order to determine the influence of inorganic adhesive on engineering spoil’s physical properties and ability of resistance to rain erosion, the plant growth substrate was sprayed onto the rock-slope model and erosion experiments were carried out under different rain intensity. The results are as follows: when the amount of inorganic binder was less than 40 kg/m3, inorganic adhesive could inhibit water evaporation and improve the engineering spoil’s water penetration and hardness; however, more inorganic adhesive (≥40 kg/m3) would increase breathability, decrease ability of moisture conservation, and increase hardness. The amount of sediment loss showed no reduction until the inorganic adhesive concentrations reached to 50 kg/m3. It could be concluded that the dosage of 40 kg/m3 was division of the impact of inorganic binder on the physical properties. And when the amount reached critical value of 50 kg/m3, the inorganic adhesive started to help the engineering spoil resisting rain erosion.