[1]CHEN Shu-yue,GU Wei,DAI Quan-yu.Experimental Study on the Use of Engineering Spoil for Plant Growth Substrate[J].Research of Soil and Water Conservation,2012,19(03):129-135.
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Research of Soil and Water Conservation[ISSN 1005-3409/CN 61-1272/P] Volume:
19
Number of periods:
2012 03
Page number:
129-135
Column:
Public date:
2012-06-20
- Title:
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Experimental Study on the Use of Engineering Spoil for Plant Growth Substrate
- Author(s):
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CHEN Shu-yue, GU Wei, DAI Quan-yu
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State Key Laboratory of Earth Processes and Resource Ecology, Beijing Normal University, Beijing 100875, China
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- Keywords:
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engineering spoil; plant growth substrate; composition and proportion
- CLC:
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S152.3
- DOI:
-
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- Abstract:
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In order to effectively utilize the engineering waste material, engineering spoil with particle size less than 2 mm was mixed with natural surface soil to form substrate for plant growth in this study. The result indicated that 50%~70% volumetric ratio of engineering spoil was preferable; the spoil with higher weathering degree had better nutrient and pH condition, water retention capability and drought resistance that facilitate plant growth; however, the nutrient content in engineering spoil was relatively low, thus additional fertilizer was required to meet the needs of plant growth; there was no significant difference in three-phase composition among the substrates with different spoil and soil proportions, but obvious variation tendencies were observed in pH, nutrient contents, soil moisture constant, seed germination rate and plant survival rate.